• CL-1000
  • CL-1000


E&R CL-1000

CL-1000 is a fully automatic plasma processing system for frame-form applications. Workpiece, e.g. diced wafer, BGA/CSP substrate, QFN lead-frame,  mounted on the dicing fame can be processed by this system.

  • Applications

    • Surface cleaning and activation prior to epoxy molding

    • Anti-tackiness treatment

    • Epoxy Molding Compound(EMC) thinning

    • Residue removal of Epoxy Molding Compound(EMC) after molding, plasma deflash

    • Residue removal of Epoxy Molding Compound(EMC) after laser drilling, plasma desmear

    • Chip sidewall etching to enhance the die strength

    • Through Silicon Via(TSV) exposing(active side attached on dicing tape)

  • Features

    • Microwave plasma source, providing isotroptic etching.

    • Cooling chuck is optional available to prevent the dicing tape from damage.

    • Rotating chuck enhances the uniform process.

    • System can be configured for 8” or 12” dicing frame.

    • Automation, SECS/GEM, is available as an option.