Thin wafer dicing
Dicing the thin wafer, below 100um thickness, is always challenging to the diamond blade. The associated defects, Include chipping, crack, peeling, metal burr and so on. Thanks to the non-contact machining, laser dicing can get the uncompromised quality at the high feed rate. When the wafer gets thinner and thinner, cutting speed of laser is faster and faster.
Top view, kerf