FOPLP (Fan-Out Panel Level Packaging)

E&R offers reliable, mass-production equipment for FOPLP processes, supporting panel sizes from 300 x 300 mm to 700 x 700 mm.
Our solutions include laser marking, laser cutting, plasma cleaning post-drilling, de-smear, laser debonding, post-debond plasma descum, and ABF drilling, all with excellent warpage handling capabilities of up to 16 mm, ensuring high-efficiency output.

E&R Solution for FOPLP/FOWLP