TGV workshop
TGV workshop
E&R has been dedicated to develop glass micro-machining techniques employed in the MEMS, display and WLO(Wafer Level Optics) devices. This patented technology is applicable to fabricate various geometric shapes.
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Through Glass Via, TGV, is usually employed as the glass interposer, 3D sensing or WLO devices
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Glass cavity, cap or spacer, to form the hermetic seal, is usually employed for MEMS or WLO packaging
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Glass frame/mesh
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Free-form, according to customer’s requirement
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Free from machining defects, e.g. crack and chipping
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Feature scale as small as 15um
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Wafer process, compatible with existed facilities
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Fast throughput
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Cost effective solution, in terms of material cost and initial investment
E&R is happy to provide process development and small-scale production services.
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Our processes can be easily customized for a variety of glasses and extended to the other materials, e.g. quartz and sapphire.
TGV :
|
Material |
Borosilicate/Quartz |
|
Wafer size |
Φ8” |
|
Thickness |
50 - 400μm |
|
Via diameter |
Φ15 μm, minimum |
|
Diameter variation |
±5% |
|
Aspect ratio |
10 : 1, maximum |
Glass cavity / cap :
|
Material |
Borosilicate |
|
Wafer size |
Φ8” |
|
Thickness |
50 - 400μm |
|
Cavity dimension |
φ0.2mm/□0.2mm, minimum |
|
Cavity shape |
customization |
|
Chipping |
≦10um |
Glass frame / spacer :
|
Material |
Borosilicate |
|
Wafer size |
Φ8” |
|
Thickness |
100 - 400μm |
|
Dimension |
Φ0.3mm/□0.3mm, minimum |
|
Shape |
customization |
|
Chipping |
≦30um |
|
Corner radius |
≧30um |