E&R is a leading expert in plasma cleaning, providing users with a variety of solutions for cleaning SiC wafers and dies. Our advanced technology, whether using Radio Frequency (13.56 MHz) or Microwave (2.54 GHz), produces excellent results, leaving the surfaces extremely hydrophilic and smooth. Additionally, for those with higher bombardment requirements, E&R also offers a Low Frequency (100-120 KHz) solution, ensuring we have the tools to meet all of your plasma cleaning needs.

Contact Angle Result:

Before plasma 80.3 deg	After plasma 5.2 deg

Surface Height Average:

Before	After
0.0137 um	0.008268 um