E&R Solution for Advanced Packaging

E&R AP (Advanced Packaging) solution focuses on advanced laser and plasma solutions, which can work on the flip-chip platform, including FCBGA, FCCSP, Fan-Out, and Fan-In (Wafer Level).

Machines are manufactured, assembled, and tested in Taiwan, with key components sourced from leading European and USA brands.
 
Overall, E&R AP solutions have been supplied over 500 sets of tools to major OSATs worldwide, we can help you develop and provide the latest & best solution base on our various experience in semiconductor industry.

E&R's global service network can also support customers with fast responding time and professional expertises.

• Laser solution:

Laser marking for molding compound, substrate solder resist, Lead Frame, Heat sink, stiffener,Wafer ID marking, Wafer backside marking, laser scribing, laser grooving. 

• Refer model: LM502, B2000, B2400, WB-200/WB-300, WID Series

• Vacuum Plasma solution:

RF or microwave plasma for before molding/underfill, before wire bonding, surface contamination removal, oxide removal and recast removal.

• Refer model: MW300, MW960, 603/604 service, MW700.

E&R Flip Chip Solution

E&R Backend Process Solution

E&R Technology for AI Product

E&R Technology for 2.5D/3D/CPO

E&R Worldwide Service Centers