钛升科技未来产品展望与核心技术蓝图

Wide Range Equipment to design for best Semicon Processes 

更广且更强大的设备应用,更好的半导体制程选择

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In the coming future, E&R not only keep our key technology and experience in substrate level equipment, but also develop into Wafer Level equipment, providing wafer level laser, plasma solution to semiconductor market.

In 2020, E&R wish to enter more different industries and offer more possibility, make the life easier, fulfill more demands and dreams! 

钛升科技不仅维持我们在Substrate Level 设备的专业技术能力和经验,同时也朝向晶圆等级的产品持续努力不懈的研发,提供市场不同的选择。 

在2020年,E&R 期许自己不只限于半导体领域,更能跨足到不同产业,提供更多不同的可能,让生活更简单,满足更多不同的需求!


Strategy in Wafer Laser Applications 

晶圓等級的設備應用策略

Back Side Scribing without Coating Material by using Femto Green

  •   Multiple Material in the same Cutting Street which Nano UV cannot perform
  •   New Material that Nano UV cannot perform but only Femto Green/UV like SiO2
  •   Hybrid Applications like Irregular Shape
  •   6/8” Wafer Back Side Scribing solutions