• GC-200

GC-200

为全自动设备,最大工作范围为8吋晶圆,
实现近乎无崩边,轴向平顺及低(或无)残留的加工。

为全自动设备,最大工作范围为8吋晶圆

    -冷加工,实现近乎无崩塌边缘,分层平顺(Ra <1um)及低(或无)残留的加工。

    -加工能力强,矩形或异形的切割皆可实现。

    -适用多种透明材料,例如玻璃,石英,蓝宝石,SiC等。

    -多重操作方式,可参数式设定或载入DXF档定义加工路径。

    -任选配:

        •机械裂片,扩张模组

        •V-cut模组

        •钻孔模组

    -通过Semi-S2认证

满足现在及未来的生产需求。


Workpiece

Diameter

8” wafer

Thickness

<2.5mm

Carrier

Wafer mounted on the dicing frame

Laser & Optics

Type

Pico-econd laser

Power

<50W or <150W

Repetition rate

<600kHz

In-situ power monitor

Moving stage

Working area

210x210mm max.

Speed

1000mm/sec, max.

Resolution

0.1um

Position accuracy

<3um for cutting

<5um for drilling

Z-axis

Stroke

+/- 3 mm

Repeatability

1um, single direction

θ-axis

Stroke

<190°

Repeatability

<2 arc-sec

Vision

Quantity

High & low magnification

Resolution

0.56um for high magnification

Mechanical breaking

(Optional)

Air blow

2~4kg/cm2

Roller ejection amount

0~10mm

Upthrust amount

0~20mm

Via drilling

(Optional software)

Data input

DXF

Raster mode available

V-cut optics

(Optional)

Single or multi foci switchable

Working distance

1mm